BGF 104C E6327

Data Sheet, V2.1, Oct. 2006 BGF104 HSMMC Interface Filter and ESD Protection Small Signal Discretes Edition 2006-10-17 Published by Infineon Technologies AG 81726 München, Germany © Infineon Technologies AG 2006. All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. BGF104 BGF104 Revision History: 2006-10-17, V2.1 Previous Version: 2006-03-03 Page Subjects (major changes since last revision) All Layout conformation Data Sheet 3 V2.1, 2006-10-17 BGF104 HSMMC Interface Filter and ESD Protection HSMMC Interface Filter and ESD Protection Feature • ESD protection and filter for High Speed Multi Media Card interface • ESD protection up to 15 kV at the external IOs • 16 pin green wafer level package with SnAgCu solder balls • 500 µm solder ball pitch • 300 µm solder ball diameter WLP-16-1 R7, 75kΩ R8, 75kΩ R9, 75kΩ R10, 75kΩ Int. IOs Ext. IOs R11, 7kΩ VMMC V dd A3 clk A2 A4 MMCclk R1, 50 Ω B4 MMCcmd R2, 50 Ω cmd A1 C4 MMCdat0 R3, 50 Ω dat0 B2 C3 MMCdat1 R4, 50 Ω dat1 B1 D4 MMCdat2 R5, 50 Ω dat2 C1 MMCdat3 R6, 50 Ω dat3 D1 D3 B3, C2, D2 GND BGF104_schematic.vsd Figure 1 Blockdiagram Description The BGF104 is an ESD protection and filter circuit for a high speed multi media card interface. External pins are protected up to 15 kV contact discharge according to IEC61000-4-2. The wafer level package is a green package with a size of only 1.96 mm x 1.96 mm and a total height of 0.65 mm. Type Package Marking Chip BGF104 WLP-16-1 BGF104 N0708 Data Sheet 4 V2.1, 2006-10-17 BGF104 HSMMC Interface Filter and ESD Protection Table 1 Maximum Ratings Parameter Symbol Values Min. VP TOP TSTG Voltage at all pins to GND Operating temperature range Storage temperature range Typ. Unit Note / Test Condition Max. -14 14 V -40 +85 °C -65 +150 °C -15 15 kV -2 2 kV Electrostatic Discharge According to IEC61000-4-2 VE VI Ext.IOs: A1, A2, A3, B1, B2, C1, D1 Int. IOs: A4, B4; C3, C4, D3, D4 Table 2 Electrical Characteristics1) Parameter Symbol Resistors R1...R6 Resistors R7...R10 Resistor R11 Reverse current of ESD protection diodes R1...6 R7...10 R11 IR Values Min. Typ. Max. 40 50 60 Ω 52.5 75 97.5 kΩ 4.9 7 9.1 kΩ 5 0.1 100 10 nA µA 16 20 pF CT Line capacitance Capacitance of each line to GND 1) at TA = 25 °C Unit Note / Test Condition VR = 3 V VR = 14V VR = 0 V R7, 75kΩ R8, 75kΩ R9, 75kΩ R10, 75kΩ Int. IOs Ext. IOs R11, 7kΩ VMMC V dd A3 MMCclk R1, 50 Ω clk A2 B4 MMCcmd R2, 50 Ω cmd A1 C4 MMCdat0 R3, 50 Ω dat0 B2 C3 MMCdat1 R4, 50 Ω dat1 B1 D4 MMCdat2 R5, 50 Ω dat2 C1 D3 MMCdat3 R6, 50 Ω dat3 D1 A4 B3, C2, D2 GND BGF104_schematic.vsd Figure 2 Data Sheet Schematic 5 V2.1, 2006-10-17 BGF104 HSMMC Interface Filter and ESD Protection 1.96 ±0.05 0.65 ±0.05 B 0.1 C 0.5 A A4 A3 A2 A1 B4 B3 B2 B1 C4 C3 C2 C1 D4 D3 D2 D1 0.5 16x ø0.05 M A B 0.3 ±0.05 1) 1) D imension is measured at the maximum solder ball diameter, parallel to primary datum C 2) Pin A1 corner identified by marking 3) Primary datum C and seating plane are defined by the spherical crowns of the balls 0.25 ±0.1 8 2.42 ±0.05 Pin 1 Corner Index Area 1) 2.42 ±0.05 1) Balls face down Data Sheet G W LN1057 Package Outline WLP-16-1 4 ±0.1 Figure 4 1.96 ±0.05 C 0.08 C 16x C OPLAN AR ITY Figure 3 3 x 0.5 = 1.5 0.5 SEATING PLANE 3) Pin A1 2) 0.25 ±0.05 STAN D OFF 3 x 0.5 = 1.5 0.95 ±0.05 CWLG1065 Tape for WLP-16-1 6 V2.1, 2006-10-17